| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element. |
| Transient DOS while parse fils IE with length equal to 1. |
| Memory corruption while processing IOCTL call for getting group info. |
| Memory corruption in HLOS while invoking IOCTL calls from user-space. |
| Memory Corruption in Audio while allocating the ion buffer during the music playback. |
| Memory corruption when there is failed unmap operation in GPU. |
| Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL. |
| Transient DOS may occur while processing the country IE. |
| Memory corruption in DSP Service during a remote call from HLOS to DSP. |
| Memory corruption while invoking HGSL IOCTL context create. |
| Memory Corruption in Data Modem while processing DMA buffer release event about CFR data. |
| Transient DOS while processing multiple IKEV2 Informational Request to device from IPSEC server with different identifiers. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption in Audio during playback with speaker protection. |
| Denial of service in WLAN due to out-of-bound read happens while processing VHT action frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Information disclosure in WLAN due to improper length check while processing authentication handshake in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |