| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Information disclosure when the ADSP payload size received in HLOS in response to Audio Stream Manager matrix session is less than this expected size. |
| Memory corruption while invoking HGSL IOCTL context create. |
| Transient DOS while parsing probe response and assoc response frame. |
| Memory corruption in Core Services while executing the command for removing a single event listener. |
| Information disclosure while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. |
| Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus. |
| Memory corruption while processing data packets in diag received from Unix clients. |
| Information disclosure while invoking callback function of sound model driver from ADSP for every valid opcode received from sound model driver. |
| Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command. |
| Memory corruption while copying the result to the transmission queue which is shared between the virtual machine and the host. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
| Memory corruption when IPv6 prefix timer object`s lifetime expires which are created while Netmgr daemon gets an IPv6 address. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Memory corruption in Audio during playback with speaker protection. |
