| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory Corruption in WLAN HOST while fetching TX status information. |
| Information disclosure in IOE Firmware while handling WMI command. |
| Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element. |
| Memory corruption in DSP Service during a remote call from HLOS to DSP. |
| Memory corruption while operating the mailbox in Automotive. |
| Memory corruption while copying a keyblob`s material when the key material`s size is not accurately checked. |
| Cryptographic issue in HLOS during key management. |
| While processing the authentication message in UE, improper authentication may lead to information disclosure. |
| Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware. |
| Memory corruption when the payload received from firmware is not as per the expected protocol size. |
| Memory corruption when BTFM client sends new messages over Slimbus to ADSP. |
| Transient DOS during hypervisor virtual I/O operation in a virtual machine. |
| Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL. |
| Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |